Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002724 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Martin Mayer, Ivan Nikitin | 2024-06-04 |
| 11978700 | Power semiconductor module arrangement | Peter Kanschat | 2024-05-07 |
| 11955450 | Method for producing a semiconductor arrangement | — | 2024-04-09 |
| 11715647 | Method for producing a substrate | Fabian Craes, Carsten Ehlers, Ulrich Wilke | 2023-08-01 |
| 11688712 | Semiconductor arrangement and method for producing the same | — | 2023-06-27 |
| 11610830 | Power semiconductor module and method for fabricating the same | Christian Schweikert, Juergen Hoegerl, Waldemar Jakobi | 2023-03-21 |
| 11557522 | Method for producing power semiconductor module arrangement | Alexander Roth | 2023-01-17 |
| 11437311 | Semiconductor module and method for producing the same | Peter Kanschat | 2022-09-06 |
| 11404336 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Martin Mayer, Ivan Nikitin | 2022-08-02 |
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Juergen Hoegerl, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg | 2022-05-03 |
| 11081414 | Power semiconductor module arrangement | Alexander Roth | 2021-08-03 |
| 10867902 | Semiconductor module and method for producing the same | Peter Kanschat | 2020-12-15 |
| 10242969 | Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same | Juergen Hoegerl, Angela Kessler, Magdalena Hoier | 2019-03-26 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Juergen Hoegerl, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg | 2019-02-19 |
| 10096584 | Method for producing a power semiconductor module | Guido Boenig, Irmgard Escher-Poeppel, Edward Fuergut, Martin Gruber, Thorsten Meyer | 2018-10-09 |
| 10043782 | Electronic device package having a dielectric layer and an encapsulant | Edward Fuergut, Holger Doepke, Michael Juerss | 2018-08-07 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Gottfried Beer, Edward Fuergut, Juergen Hoegerl, Peter Kanschat | 2018-05-29 |
| 9972596 | Chip assemblage, press pack cell and method for operating a press pack cell | Juergen Hoegerl | 2018-05-15 |
| 9818730 | Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Gottfried Beer, Irmgard Escher-Poeppel, Juergen Hoegerl, Peter Kanschat | 2017-11-14 |
| 9688060 | Method for producing a composite and a power semiconductor module | Reinhold Bayerer | 2017-06-27 |
| 9640511 | Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material | — | 2017-05-02 |
| 9627356 | Semiconductor module, semiconductor module arrangement and method for operating a semiconductor module | — | 2017-04-18 |
| 9620459 | Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement | Gottfried Beer, Irmgard Escher-Poeppel, Juergen Hoegerl, Peter Kanschat | 2017-04-11 |
| 9609748 | Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board | — | 2017-03-28 |
| 9595502 | Spring contact for semiconductor chip | Edward Fuergut, Horst Groeninger, Juergen Hoegerl | 2017-03-14 |