| 12237242 |
Semiconductor device package comprising a thermal interface material with improved handling properties |
Edward Fuergut, Alexander Roth, Karina Rott |
2025-02-25 |
| 12045379 |
Methods and apparatus for authenticating an encryption key stored in removable memory devices, to access a compute device |
Thomas Scott Morgan, Steven Yates |
2024-07-23 |
| 12002724 |
Power module with metal substrate |
Wu Hu Li, Raphael Hellwig, Olaf Hohlfeld, Ivan Nikitin |
2024-06-04 |
| 11972190 |
Isolation of compartments in a layered printed circuit board, and apparatus and methods for the same |
Thomas Scott Morgan, Steven Yates |
2024-04-30 |
| 11741269 |
Methods and apparatus for authenticating an encryption key stored in removable memory devices, to access a compute device |
Thomas Scott Morgan, Steven Yates |
2023-08-29 |
| 11626351 |
Semiconductor package with barrier to contain thermal interface material |
Ivan Nikitin, Timo Bohnenberger, Andreas Grassmann, Alexander Roth, Franz Zollner |
2023-04-11 |
| 11580287 |
Isolation of compartments in a layered printed circuit board, and apparatus and methods for the same |
Thomas Scott Morgan, Steven Yates |
2023-02-14 |
| 11404336 |
Power module with metal substrate |
Wu Hu Li, Raphael Hellwig, Olaf Hohlfeld, Ivan Nikitin |
2022-08-02 |
| 11281813 |
Methods and apparatus for authenticating an encryption key stored in removable memory devices, to access a compute device |
Thomas Scott Morgan, Steven Yates |
2022-03-22 |
| 11210446 |
Isolation of compartments in a layered printed circuit board, and apparatus and methods for the same |
Thomas Scott Morgan, Steve K. Yates |
2021-12-28 |
| 7239514 |
Heat transfer structure for electronic devices |
Edward Lopatinsky, Lev Fedoseyev |
2007-07-03 |
