Issued Patents All Time
Showing 25 most recent of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300643 | Solder stop feature for electronic devices | Adrian Lis, Peter Scherl, Achim Althaus | 2025-05-13 |
| 12283563 | Semiconductor module with bond wire loop exposed from a molded body and method for fabricating the same | Peter Luniewski | 2025-04-22 |
| 12211824 | Power semiconductor package having first and second lead frames | Thorsten Scharf, Marco Bäßler, Andreas Grassmann, Waldemar Jakobi | 2025-01-28 |
| 12002724 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Olaf Hohlfeld, Martin Mayer | 2024-06-04 |
| 11901273 | Power module with press-fit contacts | Peter Luniewski | 2024-02-13 |
| 11862533 | Fluid-cooled package having shielding layer | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Achim Strass | 2024-01-02 |
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Edward Fuergut, Irmgard Escher-Poeppel, Martin Gruber, Hans-Joachim Schulze | 2023-06-27 |
| 11682611 | Power semiconductor module | Michael Niendorf, Ludwig Busch, Oliver Markus Kreiter, Christian Neugirg | 2023-06-20 |
| 11646258 | Electronic devices including electrically insulated load electrodes | Edward Fuergut, Thomas Basler, Reinhold Bayerer | 2023-05-09 |
| 11626351 | Semiconductor package with barrier to contain thermal interface material | Timo Bohnenberger, Andreas Grassmann, Martin Mayer, Alexander Roth, Franz Zollner | 2023-04-11 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe +7 more | 2023-04-04 |
| 11598904 | Power semiconductor module and method for producing a power semiconductor module | Dirk Ahlers, Andreas Grassmann, Andre Uhlemann | 2023-03-07 |
| 11574889 | Power module comprising two substrates and method of manufacturing the same | Ottmar Geitner, Wolfram Hable, Andreas Grassmann, Frank Winter, Christian Neugirg | 2023-02-07 |
| 11450593 | Spacer frame for semiconductor packages | — | 2022-09-20 |
| 11404392 | Molded semiconductor module for PCB embedding | — | 2022-08-02 |
| 11404336 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Olaf Hohlfeld, Martin Mayer | 2022-08-02 |
| 11244886 | Package cooled with cooling fluid and comprising shielding layer | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Achim Strass | 2022-02-08 |
| 11075185 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Wei Han Koo, Chiew Li Tai | 2021-07-27 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Angela Kessler, Achim Strass | 2020-04-07 |
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Achim Strass | 2019-10-29 |
| 10453771 | Package with roughened encapsulated surface for promoting adhesion | Andreas Grassmann, Juergen Hoegerl, Kiyoung Jang | 2019-10-22 |
| 10211133 | Package with interconnections having different melting temperatures | Andreas Grassmann, Juergen Hoegerl, Angela Kessler | 2019-02-19 |
| 9847274 | Electronic module and method of manufacturing the same | Frank Winter, Ottmar Geitner, Jürgen Högerl | 2017-12-19 |
| 9627335 | Method for processing a semiconductor workpiece and semiconductor workpiece | Stephan Henneck, Evelyn Napetschnig, Daniel Pedone, Bernhard Weidgans, Simon Faiss | 2017-04-18 |