Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431450 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2025-09-30 |
| 12394697 | Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw | Thomas Bemmerl, Martin Gruber, Thorsten Meyer, Frank Singer | 2025-08-19 |
| 12249561 | Semiconductor device arrangement with compressible adhesive | Frank Singer | 2025-03-11 |
| 12218098 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Ralf Wombacher | 2025-02-04 |
| 12211824 | Power semiconductor package having first and second lead frames | Ivan Nikitin, Marco Bäßler, Andreas Grassmann, Waldemar Jakobi | 2025-01-28 |
| 12154886 | Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof | Thorsten Meyer, Martin Gruber | 2024-11-26 |
| 12027490 | Semiconductor device and method for fabricating the same | Richard Knipper, Alexander Heinrich, Stefan Schwab | 2024-07-02 |
| 12027481 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2024-07-02 |
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thomas Bemmerl, Martin Gruber, Thorsten Meyer, Frank Singer | 2024-04-09 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Tomasz Naeve, Ralf Otremba, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2024-02-27 |
| 11862600 | Method of forming a chip package and chip package | Alexander Heinrich, Steffen Jordan | 2024-01-02 |
| 11710684 | Package with separate substrate sections | Frank Singer, Martin Gruber, Thorsten Meyer, Peter Strobel, Stefan Woetzel | 2023-07-25 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Ralf Otremba, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2023-03-07 |
| 11569186 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2023-01-31 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss +3 more | 2022-11-29 |
| 11502042 | Processing of one or more carrier bodies and electronic components by multiple alignment | Thorsten Meyer, Thomas Behrens, Martin Gruber, Peter Strobel | 2022-11-15 |
| 11469161 | Lead frame-based semiconductor package | Chan Lam Cha, Wolfgang Hetzel, Swee Kah Lee, Stefan Macheiner | 2022-10-11 |
| 11309277 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Ralf Wombacher | 2022-04-19 |
| 11264356 | Batch manufacture of packages by sheet separated into carriers after mounting of electronic components | Thorsten Meyer, Thomas Behrens, Andreas Grassmann, Martin Gruber | 2022-03-01 |
| 11004700 | Temporary post-assisted embedding of semiconductor dies | Richard Knipper | 2021-05-11 |
| 10971457 | Semiconductor device comprising a composite material clip | Thomas Bemmerl, Martin Gruber | 2021-04-06 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer +1 more | 2021-03-30 |
| 10903180 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2021-01-26 |
| 10886186 | Semiconductor package system | Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss +2 more | 2021-01-05 |
| 10777491 | Package comprising carrier with chip and component mounted via opening | Thorsten Meyer | 2020-09-15 |