Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Paul Armand Asentista Calo, Theng Chao Long, Chee Yang Ng, Petteri Palm +1 more | 2024-09-17 |
| 11903132 | Power electronic assembly having a laminate inlay and method of producing the power electronic assembly | Petteri Palm, Martin Benisek, Liu Chen, Frank Daeche | 2024-02-13 |
| 11632860 | Power electronic assembly and method of producing thereof | Petteri Palm, Martin Benisek, Liu Chen, Frank Daeche | 2023-04-18 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss +3 more | 2022-11-29 |
| 11393743 | Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation | Stuart Cardwell, Chee Yang Ng, Clive O'Dell, Mark Pavier | 2022-07-19 |
| 11302613 | Double-sided cooled molded semiconductor package | Chau Fatt Chiang, Swee Kah Lee, Thomas Stoek, Chee Voon Tan | 2022-04-12 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Thorsten Meyer +1 more | 2021-03-30 |
| 10886199 | Molded semiconductor package with double-sided cooling | Chau Fatt Chiang, Swee Kah Lee, Thomas Stoek, Chee Voon Tan | 2021-01-05 |
| 10770399 | Semiconductor package having a filled conductive cavity | Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Nurfarena Othman, Joseph Victor Soosai Prakasam +1 more | 2020-09-08 |
| 7498194 | Semiconductor arrangement | Nikolaus Bott, Oliver Haeberlen, Manfred Kotek, Joost Larik, Ralf Otremba | 2009-03-03 |
| 7233059 | Semiconductor arrangement | Nikolaus Bott, Oliver Haeberlen, Manfred Kotek, Joost Larik, Ralf Otremba | 2007-06-19 |