Issued Patents All Time
Showing 1–25 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431450 | Device including semiconductor chips and method for producing such device | Thorsten Scharf | 2025-09-30 |
| 12414236 | Electronic device with castellated board | Tomasz Naeve, Urban Medic, Milad Mostofizadeh | 2025-09-09 |
| 12315835 | Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package | Eslam Abdelhamid, Thomas Gebhard, Mahadi-Ul HASSAN, Juan Sanchez, Martin Vielemeyer | 2025-05-27 |
| 12284753 | Electrostatic discharge protection of electronic component embedded in laminate of printed circuit board | Mahadi-Ul HASSAN, Thomas Gebhard | 2025-04-22 |
| 12237246 | Semiconductor devices including parallel electrically conductive layers | Robert Fehler, Josef Hoeglauer, Angela Kessler | 2025-02-25 |
| 12218098 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Thorsten Scharf, Ralf Wombacher | 2025-02-04 |
| 12176283 | Die package and method of forming a die package | — | 2024-12-24 |
| 12159829 | Semiconductor package with non-uniformly distributed vias | Sergey Yuferev, Robert Fehler | 2024-12-03 |
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Paul Armand Asentista Calo, Theng Chao Long, Josef Maerz, Chee Yang Ng +1 more | 2024-09-17 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Edward Fuergut, Martin Gruber, Bernd Schmoelzer, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12033909 | Die package and method of manufacturing a die package | Angela Kessler | 2024-07-09 |
| 12027481 | Device including semiconductor chips and method for producing such device | Thorsten Scharf | 2024-07-02 |
| 12014964 | Semiconductor package having an electrically insulating core with exposed glass fibres | Eung San Cho, Tomasz Naeve | 2024-06-18 |
| 12009290 | Semiconductor module having a multi-branch switch node connector | Sergey Yuferev, Robert Fehler, Angela Kessler, Gerhard Noebauer | 2024-06-11 |
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2024-05-28 |
| 11979096 | Multiphase inverter apparatus having half-bridge circuits and a phase output lead for each half-bridge circuit | Tomasz Naeve, Elvir Kahrimanovic | 2024-05-07 |
| 11978693 | Semiconductor device package comprising side walls connected with contact pads of a semiconductor die | Ulrich Froehler, Ralf Otremba, Andreas Riegler | 2024-05-07 |
| 11903132 | Power electronic assembly having a laminate inlay and method of producing the power electronic assembly | Martin Benisek, Liu Chen, Frank Daeche, Josef Maerz | 2024-02-13 |
| 11791255 | Die package and method of forming a die package | — | 2023-10-17 |
| 11792941 | Circuit board structure and method for manufacturing a circuit board structure | Risto Tuominen, Antti Iihola | 2023-10-17 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2023-10-03 |
| 11664304 | Semiconductor module | Sergey Yuferev, Robert Fehler, Angela Kessler, Gerhard Noebauer | 2023-05-30 |
| 11632860 | Power electronic assembly and method of producing thereof | Martin Benisek, Liu Chen, Frank Daeche, Josef Maerz | 2023-04-18 |
| 11569186 | Device including semiconductor chips and method for producing such device | Thorsten Scharf | 2023-01-31 |
| 11539291 | Method of manufacturing a power semiconductor system | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2022-12-27 |