Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308339 | Method of manufacturing a package using a clip having at least one locking recess | Melvin Levardo, Ryan Ross Agbay Alinea | 2025-05-20 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Martin Gruber, Elvir Kahrimanovic | 2024-02-27 |
| 11776882 | Method of fabricating a semiconductor package | Petteri Palm, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2023-10-03 |
| 11728309 | Clip having locking recess for connecting an electronic component with a carrier in a package | Melvin Levardo, Ryan Ross Agbay Alinea | 2023-08-15 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Martin Gruber, Elvir Kahrimanovic | 2023-03-07 |
| 11342252 | Leadframe leads having fully plated end faces | Stefan Macheiner | 2022-05-24 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Petteri Palm, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2022-04-12 |
| 10903133 | Method of producing an SMD package with top side cooling | Ralf Otremba, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner, Guenther Lohmann +2 more | 2021-01-26 |
| 10813229 | Electronic module having an electrically insulating structure with material having a low modulus of elasticity | Toni Salminen | 2020-10-20 |
| 10796986 | Leadframe leads having fully plated end faces | Stefan Macheiner | 2020-10-06 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess, Xaver Schloegel | 2020-06-30 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner, Guenther Lohmann +2 more | 2020-02-18 |
| 10168391 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Toni Salminen, Stefan Mieslinger +4 more | 2019-01-01 |
| 9935027 | Electronic device including a metal substrate and a semiconductor module embedded in a laminate | — | 2018-04-03 |
| 9922904 | Semiconductor device including lead frames with downset | — | 2018-03-20 |
| 9881853 | Semiconductor package having a source-down configured transistor die and a drain-down configured transistor die | Dirk Ahlers | 2018-01-30 |
| 9681558 | Module with integrated power electronic circuitry and logic circuitry | Liu Chen, Toni Salminen | 2017-06-13 |
| 9570433 | Semiconductor device and method for manufacturing a semiconductor device | Markus Zundel, Vanessa Capodieci, Uwe Schmalzbauer | 2017-02-14 |
| 9564578 | Semiconductor package with integrated magnetic field sensor | Thorsten Meyer, Martin Gruber, Rainer Markus Schaller, Franz Jost, Stefan Mieslinger +4 more | 2017-02-07 |
| 9564423 | Power package with integrated magnetic field sensor | Liu Chen, Toni Salminen, Stefan Mieslinger, Giuliano Angelo Babulano, Jens Oetjen +1 more | 2017-02-07 |
| 9385059 | Overmolded substrate-chip arrangement with heat sink | Peter Ossimitz, Juergen Schaefer, Liu Chen, Stefan Macheiner | 2016-07-05 |
| 9171777 | Semiconductor device and method for manufacturing a semiconductor device | Markus Zundel, Vanessa Capodieci, Uwe Schmalzbauer | 2015-10-27 |
| 8466009 | Method of fabricating a semiconductor package with mold lock opening | Bernd Goller, Wae Chet Yong, Teck Sim Lee, Boon Kian Lim | 2013-06-18 |
| 8120161 | Semiconductor module including semiconductor chips coupled to external contact elements | Ralf Otremba, Lutz Goergens, Gerhard Noebauer, Tien Lai Tan, Erwin Huber +2 more | 2012-02-21 |
| 7732937 | Semiconductor package with mold lock vent | Bernd Goller, Wae Chet Yong, Teck Sim Lee, Boon Kian Lim | 2010-06-08 |