Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466009 | Method of fabricating a semiconductor package with mold lock opening | Bernd Goller, Markus Dinkel, Wae Chet Yong, Teck Sim Lee | 2013-06-18 |
| 8030742 | Electronic device having profiled elements extending from planar surfaces | Yang Hong Heng | 2011-10-04 |
| 7732937 | Semiconductor package with mold lock vent | Bernd Goller, Markus Dinkel, Wae Chet Yong, Teck Sim Lee | 2010-06-08 |