Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Paul Armand Asentista Calo, Theng Chao Long, Josef Maerz, Chee Yang Ng +1 more | 2024-09-17 |
| 11569196 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Chau Fatt Chiang, Stefan Macheiner | 2023-01-31 |
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Chau Fatt Chiang, Stefan Macheiner | 2021-09-28 |
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wee Boon Tay | 2021-04-13 |
| 8466009 | Method of fabricating a semiconductor package with mold lock opening | Bernd Goller, Markus Dinkel, Teck Sim Lee, Boon Kian Lim | 2013-06-18 |
| 8377753 | Method of fabricating a semiconductor device having a resin with warpage compensated structures | Chai Wei Heng, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml | 2013-02-19 |
| 8207601 | Electronic component and a method of fabricating an electronic component | Khai Huat Jeffrey Low, Chai Wei Heng | 2012-06-26 |
| 8169069 | Integrated semiconductor outline package | Stanley Job Doraisamy | 2012-05-01 |
| 8110906 | Semiconductor device including isolation layer | Joachim Mahler, Stanley Job Doraisamy, Gerhard Deml, Rupert Fischer, Reimund Engl | 2012-02-07 |
| 8067841 | Semiconductor devices having a resin with warpage compensated surfaces | Chai Wei Heng, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml | 2011-11-29 |
| 7821141 | Semiconductor device | Teck Sim Lee, Erich Griebl, Mario Feldvoss, Juergen Schredl | 2010-10-26 |
| 7791182 | Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing | Mohd Fauzi HJ Mahat, Stanley Job Doraisamy, Tien Lai Tan | 2010-09-07 |
| 7732937 | Semiconductor package with mold lock vent | Bernd Goller, Markus Dinkel, Teck Sim Lee, Boon Kian Lim | 2010-06-08 |
| 7723165 | Method of forming component package | Soon Hock Tong, Stanley Job Doraisamy | 2010-05-25 |