Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11949006 | Power semiconductor device with p-contact and doped insulation blocks defining contact holes | Markus Beninger-Bina, Matteo Dainese, Ingo Dirnstorfer, Johannes Georg Laven, Anton Mauder +1 more | 2024-04-02 |
| 11888061 | Power semiconductor device having elevated source regions and recessed body regions | Markus Beninger-Bina, Matteo Dainese, Ingo Dirnstorfer | 2024-01-30 |
| 11610986 | Power semiconductor switch having a cross-trench structure | Matteo Dainese, Alexander Philippou, Markus Beninger-Bina, Ingo Dirnstorfer, Christian Jaeger +3 more | 2023-03-21 |
| 11515264 | Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer | Francisco Javier Santos Rodriguez, Alexander Breymesser, Michael Knabl, Matthias Kuenle, Andreas Moser +4 more | 2022-11-29 |
| 11469317 | RC IGBT | Frank Pfirsch, Viktoryia Lapidus, Anton Mauder, Christian Philipp Sandow, Antonio Vellei | 2022-10-11 |
| 11257946 | Method of forming a power semiconductor device | Markus Beninger-Bina, Matteo Dainese, Ingo Dirnstorfer | 2022-02-22 |
| 11075290 | Power semiconductor device having a cross-trench arrangement | Matteo Dainese, Alexander Philippou, Markus Bina, Ingo Dirnstorfer, Christian Jaeger +3 more | 2021-07-27 |
| 11018051 | Power semiconductor device with reliably verifiable p-contact and method | Markus Beninger-Bina, Matteo Dainese, Ingo Dirnstorfer, Johannes Georg Laven, Anton Mauder +1 more | 2021-05-25 |
| 11011629 | Power semiconductor switch with improved controllability | Markus Beninger-Bina, Matteo Dainese, Ingo Dirnstorfer, Caspar Leendertz, Christian Philipp Sandow | 2021-05-18 |
| 10629676 | Semiconductor device with cell trench structures and recessed contacts and method of manufacturing a semiconductor device | Johannes Georg Laven, Maria Cotorogea, Hans-Joachim Schulze, Haybat Itani, Andreas Haghofer | 2020-04-21 |
| 10600862 | High voltage termination structure of a power semiconductor device | Frank Wolter, Andreas Moser, Manfred Pfaffenlehner | 2020-03-24 |
| 10424645 | Semiconductor device, method for testing a semiconductor device and method for forming a semiconductor device | Alexander Philippou, Johannes Georg Laven, Maria Cotorogea | 2019-09-24 |
| 10304952 | Power semiconductor device with dV/dt controllability and cross-trench arrangement | Matteo Dainese, Alexander Philippou, Markus Bina, Ingo Dirnstorfer, Christian Jaeger +3 more | 2019-05-28 |
| 10177248 | Semiconductor device | Matteo Dainese | 2019-01-08 |
| 9997359 | Semiconductor device with rear-side insert structure | Johannes Georg Laven, Hans-Joachim Schulze, Anton Mauder | 2018-06-12 |
| 9825023 | Insulated gate bipolar transistor comprising negative temperature coefficient thermistor | Thomas Basler, Joachim Mahler, Daniel Pedone, Wolfgang Scholz, Philipp Seng +2 more | 2017-11-21 |
| 9666663 | Semiconductor device with cell trench structures and contacts and method of manufacturing a semiconductor device | Johannes Georg Laven, Maria Cotorogea, Hans-Joachim Schulze, Haybat Itani, Andreas Haghofer | 2017-05-30 |
| 9640401 | Method of manufacturing a semiconductor device having a rear-side insert structure | Johannes Georg Laven, Hans-Joachim Schulze, Anton Mauder | 2017-05-02 |
| 9406572 | Method for processing a substrate and a method of process screening for integrated circuits | Rudolf Zelsacher, Peter Irsigler, Manfred Pirker, Andreas Moser | 2016-08-02 |
| 9385222 | Semiconductor device with insert structure at a rear side and method of manufacturing | Johannes Georg Laven, Hans-Joachim Schulze, Anton Mauder | 2016-07-05 |
| 9224806 | Edge termination structure with trench isolation regions | Stephan Voss, Alexander Breymesser, Hans-Joachim Schulze, Oliver Haeberlen, Andreas Moser | 2015-12-29 |
| 9111989 | Insulated gate bipolar transistor including emitter short regions | Stephan Voss, Alexander Breymesser | 2015-08-18 |
| 8815647 | Chip package and a method for manufacturing a chip package | Ralf Otremba, Bernd Roemer, Fabio Brucchi | 2014-08-26 |
| 8766430 | Semiconductor modules and methods of formation thereof | Ralf Otremba, Davide Chiola, Fabio Brucchi | 2014-07-01 |
| 7821141 | Semiconductor device | Wae Chet Yong, Teck Sim Lee, Mario Feldvoss, Juergen Schredl | 2010-10-26 |