Issued Patents All Time
Showing 1–25 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412740 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Hans-Joachim Schulze | 2025-09-09 |
| 12363961 | Semiconductor device | Carsten Schaeffer, Patrick HANEKAMP, Oliver Humbel, Angelika Koprowski, Wolfgang Lehnert | 2025-07-15 |
| 12356700 | Method for splitting semiconductor wafers | Christian Beyer, Hans-Joachim Schulze, Marko Swoboda | 2025-07-08 |
| 12272738 | Methods of forming semiconductor devices in a layer of epitaxial silicon carbide | Hans-Joachim Schulze, Roland Rupp | 2025-04-08 |
| 12249504 | Manufacturing and reuse of semiconductor substrates | Bernhard Goller, Alexander Binter, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Iris Moder +2 more | 2025-03-11 |
| 12211703 | Methods for forming a semiconductor device having a second semiconductor layer on a first semiconductor layer | Hans-Joachim Schulze, Alexander Breymesser, Bernhard Goller, Matthias Kuenle, Helmut Oefner +1 more | 2025-01-28 |
| 12034066 | Power semiconductor device having a barrier region | Antonio Vellei, Markus Beninger-Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +1 more | 2024-07-09 |
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2024-07-09 |
| 11990520 | Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures | Andre Brockmeier, Guenter Denifl, Ronny Kern, Michael Knabl, Matteo Piccin | 2024-05-21 |
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Günter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2024-01-30 |
| 11881406 | Method of manufacturing a semiconductor device and semiconductor wafer | Roland Rupp, Hans-Joachim Schulze | 2024-01-23 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Hans-Joachim Schulze | 2024-01-23 |
| 11856711 | Rogowski coil integrated in glass substrate | Alexander Breymesser, Klaus Sobe | 2023-12-26 |
| 11742215 | Methods for forming a semiconductor device | Hans-Joachim Schulze, Alexander Breymesser, Bernhard Goller, Matthias Kuenle, Helmut Oefner +1 more | 2023-08-29 |
| 11735642 | Methods of re-using a silicon carbide substrate | Hans-Joachim Schulze, Roland Rupp | 2023-08-22 |
| 11626371 | Semiconductor structure with one or more support structures | Markus Harfmann | 2023-04-11 |
| 11581428 | IGBT with dV/dt controllability | Alexander Philippou, Markus Beninger-Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +3 more | 2023-02-14 |
| 11576259 | Carrier, laminate and method of manufacturing semiconductor devices | Hans-Joachim Schulze, Andre Brockmeier, Tobias Franz Wolfgang Hoechbauer, Gerhard Metzger-Brueckl, Matteo Piccin | 2023-02-07 |
| 11515264 | Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer | Alexander Breymesser, Erich Griebl, Michael Knabl, Matthias Kuenle, Andreas Moser +4 more | 2022-11-29 |
| 11502190 | Vertical power semiconductor device, semiconductor wafer or bare-die arrangement, carrier, and method of manufacturing a vertical power semiconductor device | Andre Brockmeier, Hans-Joachim Schulze | 2022-11-15 |
| 11476111 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Hans-Joachim Schulze | 2022-10-18 |
| 11417528 | Method of manufacturing a semiconductor device and semiconductor wafer | Roland Rupp, Hans-Joachim Schulze | 2022-08-16 |
| 11393784 | Semiconductor package devices and method for forming semiconductor package devices | Roland Rupp, Alexander Breymesser, Andre Brockmeier, Carsten von Koblinski, Ronny Kern | 2022-07-19 |
| 11342433 | Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices | Ralf Siemieniec, Thomas Aichinger, Iris Moder, Hans-Joachim Schulze, Carsten von Koblinski | 2022-05-24 |
| 11329021 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Fabian Craes, Barbara Eichinger, Martin Mischitz, Frederik Otto, Fabien Thion | 2022-05-10 |