Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756923 | High density and durable semiconductor device interconnect | Marian Sebastian Broll, Alexander Herbrandt, Alparslan Takkac | 2023-09-12 |
| 11552048 | Semiconductor device including an electrical contact with a metal layer arranged thereon | Oliver Hellmund, Thorsten Meyer, Ingo Muri | 2023-01-10 |
| 11488921 | Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect | Ali Roshanghias, Alfred Binder, Stefan Karner, Martin Mischitz, Rainer Pelzer | 2022-11-01 |
| 11329021 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Francisco Javier Santos Rodriguez, Fabian Craes, Martin Mischitz, Frederik Otto, Fabien Thion | 2022-05-10 |
| 10199372 | Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures | Ingo Muri, Iris Moder, Oliver Hellmund, Johannes Baumgartl, Annette Saenger +2 more | 2019-02-05 |
| 9929111 | Method of manufacturing a layer structure having partially sealed pores | Martin Mischitz, Markus Heinrici, Manfred Schneegans, Stefan Krivec | 2018-03-27 |
| 9620466 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Martin Mischitz, Markus Heinrici, Manfred Schneegans, Stefan Krivec | 2017-04-11 |