Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488921 | Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect | Ali Roshanghias, Alfred Binder, Barbara Eichinger, Stefan Karner, Rainer Pelzer | 2022-11-01 |
| 11329021 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Francisco Javier Santos Rodriguez, Fabian Craes, Barbara Eichinger, Frederik Otto, Fabien Thion | 2022-05-10 |
| 10580753 | Method for manufacturing semiconductor devices | Harald Huber, Michael Knabl, Claudia Sgiarovello, Caterina Travan, Andrew Christopher Graeme Wood | 2020-03-03 |
| 10515910 | Semiconductor device having a porous metal layer and an electronic device having the same | Kurt Matoy | 2019-12-24 |
| 10373868 | Method of processing a porous conductive structure in connection to an electronic component on a substrate | Markus Heinrici, Michael Roesner, Oliver Hellmund, Caterina Travan, Manfred Schneegans +2 more | 2019-08-06 |
| 10340197 | Integrated circuit substrate having configurable circuit elements | Claudia Sgiarovello, Andrew Christopher Graeme Wood | 2019-07-02 |
| 10269635 | Integrated circuit substrate and method for manufacturing the same | Claudia Sgiarovello, Andrew Christopher Graeme Wood | 2019-04-23 |
| 9929111 | Method of manufacturing a layer structure having partially sealed pores | Markus Heinrici, Barbara Eichinger, Manfred Schneegans, Stefan Krivec | 2018-03-27 |
| 9911686 | Source down semiconductor devices and methods of formation thereof | Manfred Schneegans, Andreas Meiser, Michael Roesner, Michael Pinczolits | 2018-03-06 |
| 9899277 | Integrated circuit substrate and method for manufacturing the same | Claudia Sgiarovello, Andrew Christopher Graeme Wood | 2018-02-20 |
| 9844134 | Device including a metallization layer and method of manufacturing a device | Markus Heinrici, Stefan Schwab | 2017-12-12 |
| 9818602 | Method of depositing a resin material on a semiconductor body with an inkjet process | Stefan Schwab, Markus Heinrici, Rafael Janski, Susanne Kraeuter | 2017-11-14 |
| 9793119 | Method for structuring a substrate using a protection layer as a mask | Markus Heinrici, Florian Bernsteiner | 2017-10-17 |
| 9786568 | Method of manufacturing an integrated circuit substrate | Claudia Sgiarovello, Andrew Christopher Graeme Wood | 2017-10-10 |
| 9768023 | Method for structuring a substrate | Markus Heinrici, Florian Bernsteiner | 2017-09-19 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Michael Roesner, Markus Heinrici, Gudrun Stranzl, Martin Zgaga | 2017-06-06 |
| 9640419 | Carrier system for processing semiconductor substrates, and methods thereof | Manfred Schneegans, Michael Roesner, Michael Pinczolits | 2017-05-02 |
| 9620466 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Markus Heinrici, Barbara Eichinger, Manfred Schneegans, Stefan Krivec | 2017-04-11 |
| 9368436 | Source down semiconductor devices and methods of formation thereof | Manfred Schneegans, Andreas Meiser, Michael Roesner, Michael Pinczolits | 2016-06-14 |
| 9190322 | Method for producing a copper layer on a semiconductor body using a printing process | Manfred Schneegans, Markus Heinrici | 2015-11-17 |
| 9177790 | Inkjet printing in a peripheral region of a substrate | Karl Heinz Gasser, John F. Cooper, Kae-Horng Wang | 2015-11-03 |
| 8704514 | Current sensor including a sintered metal layer | Mario Motz, Udo Ausserlechner | 2014-04-22 |