Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581194 | Sintering method using a sacrificial layer on the backside metallization of a semiconductor die | Paul Frank | 2023-02-14 |
| 11329021 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Francisco Javier Santos Rodriguez, Fabian Craes, Barbara Eichinger, Martin Mischitz, Fabien Thion | 2022-05-10 |
| 9659793 | Method for producing a material-bonding connection between a semiconductor chip and a metal layer | Nicolas Heuck, Christian Steininger | 2017-05-23 |