Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195713 | Methods of forming a silicon-insulator layer and semiconductor device having the same | Joachim Hirschler, Georg Ehrentraut, Christoffer Erbert, Klaus Goeschl, Michael Hutzler +6 more | 2021-12-07 |
| 10967450 | Slicing SiC material by wire electrical discharge machining | Nirdesh Ojha, Francisco Javier Santos Rodriguez, Roland Rupp, Karin Delalut, Claudia Friza | 2021-04-06 |
| 10453806 | Methods for forming semiconductor devices and semiconductor device | Joachim Hirschler, Christoffer Erbert, Mathias Plappert, Caterina Travan | 2019-10-22 |
| 10373868 | Method of processing a porous conductive structure in connection to an electronic component on a substrate | Martin Mischitz, Michael Roesner, Oliver Hellmund, Caterina Travan, Manfred Schneegans +2 more | 2019-08-06 |
| 9929111 | Method of manufacturing a layer structure having partially sealed pores | Martin Mischitz, Barbara Eichinger, Manfred Schneegans, Stefan Krivec | 2018-03-27 |
| 9844134 | Device including a metallization layer and method of manufacturing a device | Martin Mischitz, Stefan Schwab | 2017-12-12 |
| 9818602 | Method of depositing a resin material on a semiconductor body with an inkjet process | Stefan Schwab, Rafael Janski, Susanne Kraeuter, Martin Mischitz | 2017-11-14 |
| 9793119 | Method for structuring a substrate using a protection layer as a mask | Martin Mischitz, Florian Bernsteiner | 2017-10-17 |
| 9768023 | Method for structuring a substrate | Martin Mischitz, Florian Bernsteiner | 2017-09-19 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Michael Roesner, Gudrun Stranzl, Martin Mischitz, Martin Zgaga | 2017-06-06 |
| 9620466 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Martin Mischitz, Barbara Eichinger, Manfred Schneegans, Stefan Krivec | 2017-04-11 |
| 9190322 | Method for producing a copper layer on a semiconductor body using a printing process | Martin Mischitz, Manfred Schneegans | 2015-11-17 |