Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2024-12-31 |
| 11764176 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2023-09-19 |
| 11195713 | Methods of forming a silicon-insulator layer and semiconductor device having the same | Joachim Hirschler, Georg Ehrentraut, Klaus Goeschl, Markus Heinrici, Michael Hutzler +6 more | 2021-12-07 |
| 10453806 | Methods for forming semiconductor devices and semiconductor device | Joachim Hirschler, Markus Heinrici, Mathias Plappert, Caterina Travan | 2019-10-22 |