Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Christoffer Erbert, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2024-12-31 |
| 11764176 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Christoffer Erbert, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2023-09-19 |
| 11387359 | Ppower semiconductor device with anticorrosive edge termination structure | Oliver Humbel, Josef Bauer, Diana Car, Philipp Koch, Angelika Koprowski +4 more | 2022-07-12 |
| 10388722 | Power semiconductor device termination structure | Elmar Falck, Josef Bauer, Hans-Joachim Schulze | 2019-08-20 |