Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2024-12-31 |
| 12040288 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Michael Rogalli | 2024-07-16 |
| 11776927 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Alexander Heinrich, Bernhard Weidgans, Catharina Wille, Christina Yeong | 2023-10-03 |
| 11764176 | Semiconductor device including bonding pad metal layer structure | Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2023-09-19 |
| 11735534 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Michael Rogalli | 2023-08-22 |
| 11615963 | Electronic device, electronic module and methods for fabricating the same | Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz +6 more | 2023-03-28 |
| 11501979 | Semiconductor device and method of producing a semiconductor device | Markus Beninger-Bina, Andreas Behrendt, Mark Harrison, Robert Hartl, Peter Imrich +1 more | 2022-11-15 |
| 11424201 | Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device | Michael Rogalli, Johann Gatterbauer, Wolfgang Lehnert, Kurt Matoy, Manfred Schneegans +1 more | 2022-08-23 |
| 11410950 | Semiconductor substrate having a bond pad material based on aluminum | Gert Pfahl, Daniel Bolowski, Marian Sebastian Broll, Michael Kreuz, Holger Schulze +1 more | 2022-08-09 |
| 11367654 | Component and method of manufacturing a component using an ultrathin carrier | Karl Mayer, Michael Pinczolits, Michael Sternad, Michael Roesner | 2022-06-21 |
| 11069644 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Alexander Heinrich, Bernhard Weidgans, Catharina Wille, Christina Yeong | 2021-07-20 |
| 10930614 | Chip arrangements | Manfred Mengel, Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger +2 more | 2021-02-23 |
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Muhammad Muhammat Sanusi, Nurfarena Othman +1 more | 2021-02-09 |
| 10741402 | Electronic device, electronic module and methods for fabricating the same | Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz +6 more | 2020-08-11 |
| 10573611 | Solder metallization stack and methods of formation thereof | Kamil Karlovsky, Michael Ehmann, Mark Harrison, Anton Pugatschow | 2020-02-25 |
| 10276362 | Method for processing a semiconductor region and an electronic device | Sandra Wirtitsch, Mario Barusic, Aleksander Hinz, Robert Hartl, Georg Schinner | 2019-04-30 |
| 10262959 | Semiconductor devices and methods of forming thereof | Ulrike Fastner, Alexander Heinrich, Thomas Fischer | 2019-04-16 |
| 10186458 | Component and method of manufacturing a component using an ultrathin carrier | Karl Mayer, Michael Pinczolits, Michael Sternad, Michael Roesner | 2019-01-22 |
| 10115688 | Solder metallization stack and methods of formation thereof | Kamil Karlovsky, Michael Ehmann, Mark Harrison, Anton Pugatschow | 2018-10-30 |
| 9735126 | Solder alloys and arrangements | Manfred Mengel, Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger +2 more | 2017-08-15 |
| 9627335 | Method for processing a semiconductor workpiece and semiconductor workpiece | Stephan Henneck, Daniel Pedone, Bernhard Weidgans, Simon Faiss, Ivan Nikitin | 2017-04-18 |
| 9484316 | Semiconductor devices and methods of forming thereof | Ulrike Fastner, Alexander Heinrich, Thomas Fischer | 2016-11-01 |
| 8866299 | Backside processing of semiconductor devices | Mark Harrison, Franz Stueckler | 2014-10-21 |
| 8487440 | Backside processing of semiconductor devices | Mark Harrison, Franz Stueckler | 2013-07-16 |