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Chip package and method of forming a chip package |
Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Evelyn Napetschnig |
2024-07-16 |
| 11735534 |
Chip package and method of forming a chip package |
Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Evelyn Napetschnig |
2023-08-22 |
| 11424201 |
Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device |
Johann Gatterbauer, Wolfgang Lehnert, Kurt Matoy, Evelyn Napetschnig, Manfred Schneegans +1 more |
2022-08-23 |
| 10446469 |
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element |
Thomas Detzel, Johann Gross, Robert Illing, Maximilian Krug, Sven Lanzerstorfer +3 more |
2019-10-15 |
| 10103123 |
Semiconductor devices and processing methods |
Wolfgang Lehnert |
2018-10-16 |
| 9418937 |
Integrated circuit and method of forming an integrated circuit |
Thomas Detzel, Johann Gross, Robert Illing, Maximilian Krug, Sven Lanzerstorfer +3 more |
2016-08-16 |
| 9385031 |
Method for providing a self-aligned pad protection in a semiconductor device |
Wolfgang Lehnert |
2016-07-05 |
| 9165821 |
Method for providing a self-aligned pad protection in a semiconductor device |
Wolfgang Lehnert |
2015-10-20 |
| 7169716 |
Photosensitive lacquer for providing a coating on a semiconductor substrate or a mask |
Lars Volkel |
2007-01-30 |
| 6958256 |
Process for the back-surface grinding of wafers |
Manfred Schneegans |
2005-10-25 |
| 6790737 |
Method for fabricating thin metal layers from the liquid phase |
Manfred Schneegans, Wolfgang Jaeger |
2004-09-14 |
| 6380076 |
Dielectric filling of electrical wiring planes |
Markus Kirchhoff, Stephan Wege |
2002-04-30 |
| 5917705 |
Chip card |
Josef Kirschbauer, Erich Hopf, Günther Grönninger, Jurgen Fischer, Gunter Didschies +1 more |
1999-06-29 |
| 5780103 |
Method for forming of a silicon oxide layer on a topography |
Dirk Toebben, Doerthe Groteloh, Oswald Spindler |
1998-07-14 |
| 5468786 |
Radiation-curable reaction resin system |
Heiner Bayer, Barbara Lehner |
1995-11-21 |
| 5227219 |
Surface wave components with an acoustically matched damping compound |
Heiner Bayer, Frank Dittrich, Hans Stelzl |
1993-07-13 |
