Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040288 | Chip package and method of forming a chip package | Johann Gatterbauer, Wolfgang Lehnert, Evelyn Napetschnig, Michael Rogalli | 2024-07-16 |
| 11735534 | Chip package and method of forming a chip package | Johann Gatterbauer, Wolfgang Lehnert, Evelyn Napetschnig, Michael Rogalli | 2023-08-22 |
| 11328935 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Johann Gatterbauer, Wolfgang Lehnert, Norbert Mais, Verena Muhr, Edmund Riedl | 2022-05-10 |
| 8573236 | Apparatus and method for ultrasonic wet treatment of plate-like articles | Rainer Obweger, Alexander R. Lippert | 2013-11-05 |
| 7279116 | Method for the wet treatment of disk-like objects | — | 2007-10-09 |