Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288727 | Method of manufacturing a package having an adhesion promoter | Steffen Jordan, Stefan Miethaner, Stefan Schwab | 2025-04-29 |
| 12136578 | Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations | Stefan Schwab | 2024-11-05 |
| 11652012 | Inorganic encapsulant for electronic component with adhesion promoter | Steffen Jordan, Stefan Miethaner, Stefan Schwab | 2023-05-16 |
| 11450642 | Soldering a conductor to an aluminum metallization | Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2022-09-20 |
| 11328935 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Johann Gatterbauer, Wolfgang Lehnert, Norbert Mais, Verena Muhr, Harry Sax | 2022-05-10 |
| 10930614 | Chip arrangements | Manfred Mengel, Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger +2 more | 2021-02-23 |
| 10896893 | Soldering a conductor to an aluminum metallization | Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2021-01-19 |
| 10892247 | Soldering a conductor to an aluminum metallization | Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2021-01-12 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10615145 | Soldering a conductor to an aluminum metallization | Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2020-04-07 |
| 10366946 | Connection member with bulk body and electrically and thermally conductive coating | Wu Hu Li, Thomas Horedt, Ali Mazloum-Nejadari | 2019-07-30 |
| 9735126 | Solder alloys and arrangements | Manfred Mengel, Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger +2 more | 2017-08-15 |
| 8603864 | Method of fabricating a semiconductor device | Ivan Nikitin, Johannes Lodermeyer, Robert Bergmann, Karsten Guth | 2013-12-10 |
| 8410586 | Semiconductor package and method of assembling a semiconductor package | Steffen Jordan, Christof Matthias Schilz, Fee Hoon Wendy Wong | 2013-04-02 |
| 8177878 | Bonding material with exothermically reactive heterostructures | Alexander Heinrich, Thorsten Scharf, Steffan Jordan | 2012-05-15 |
| 8156643 | Semiconductor device | Manfred Schneegans, Markus Leicht, Stefan Woehlert | 2012-04-17 |
| 8147621 | Method for producing a metal article intended for at least partially coating with a substance | Wolfgang Schober | 2012-04-03 |
| 7989930 | Semiconductor package | Joachim Mahler, Johannes Lodermeyer, Mathias Vaupel, Steffen Jordan | 2011-08-02 |
| 7909978 | Method of making an integrated circuit including electrodeposition of metallic chromium | Johannes Lodermeyer, Werner Robl | 2011-03-22 |
| 7911061 | Semiconductor device | Manfred Schneegans, Markus Leicht, Stefan Wohlert | 2011-03-22 |
| 7874475 | Method for the planar joining of components of semiconductor devices and a diffusion joining structure | Khalil Hosseini, Joachim Mahler, Ivan Galesic, Konrad Roesl | 2011-01-25 |
| 7851910 | Diffusion soldered semiconductor device | — | 2010-12-14 |
| 7705472 | Semiconductor device with semiconductor device components embedded in a plastic housing composition | Joachim Mahler, Ralf Wombacher, Dieter Lachman, Bernd Betz, Stefan Paulus | 2010-04-27 |
| 7540950 | Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layer | Wolfgang Schober | 2009-06-02 |
| 7511382 | Semiconductor chip arrangement and method | Ralf Otremba, Ivan Galesic | 2009-03-31 |