Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327727 | Chip with a silicon carbide substrate | Stefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler | 2025-06-10 |
| 11842938 | Semiconductor device and method for forming a semiconductor device | Jens Peter Konrath, Wolfgang Bergner, Romain Esteve, Richard Gaisberger, Florian Grasse +7 more | 2023-12-12 |
| 11798807 | Process for producing an electrical contact on a silicon carbide substrate | Stefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler | 2023-10-24 |
| 11615963 | Electronic device, electronic module and methods for fabricating the same | Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz +6 more | 2023-03-28 |
| 11410950 | Semiconductor substrate having a bond pad material based on aluminum | Gert Pfahl, Daniel Bolowski, Marian Sebastian Broll, Michael Kreuz, Evelyn Napetschnig +1 more | 2022-08-09 |
| 11217500 | Semiconductor device and method for forming a semiconductor device | Jens Peter Konrath, Wolfgang Bergner, Romain Esteve, Richard Gaisberger, Florian Grasse +7 more | 2022-01-04 |
| 11043383 | Electrical contact connection on silicon carbide substrate | Stefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler | 2021-06-22 |
| 10741402 | Electronic device, electronic module and methods for fabricating the same | Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz +6 more | 2020-08-11 |
| 10446469 | Semiconductor device having a copper element and method of forming a semiconductor device having a copper element | Thomas Detzel, Johann Gross, Robert Illing, Maximilian Krug, Sven Lanzerstorfer +3 more | 2019-10-15 |
| 9935060 | Method for processing a wafer and wafer structure | Srinivasa Reddy Yeduru, Karl Heinz Gasser, Karl Mayer, Francisco Javier Santos Rodriguez | 2018-04-03 |
| 9812376 | Electrically conductive element, power semiconductor device having an electrically conductive element and method of manufacturing a power semiconductor device | Michael Nelhiebel, Siegfried Roehl | 2017-11-07 |
| 9634108 | Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching | Roland Rupp, Thomas Gutt, Michael Treu | 2017-04-25 |
| 9589880 | Method for processing a wafer and wafer structure | Srinivasa Reddy Yeduru, Karl Heinz Gasser, Karl Mayer, Francisco Javier Santos Rodriguez | 2017-03-07 |
| 9418937 | Integrated circuit and method of forming an integrated circuit | Thomas Detzel, Johann Gross, Robert Illing, Maximilian Krug, Sven Lanzerstorfer +3 more | 2016-08-16 |
| 9391154 | Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching | Roland Rupp, Thomas Gutt, Michael Treu | 2016-07-12 |
| 9209281 | Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching | Roland Rupp, Thomas Gutt, Michael Treu | 2015-12-08 |
| 8502274 | Integrated circuit including power transistor cells and a connecting line | Kurt Matoy, Thomas Detzel, Michael Nelhiebel, Arno Zechmann, Stefan Decker +4 more | 2013-08-06 |
| 8324115 | Semiconductor chip, semiconductor device and methods for producing the same | Ralf Otremba, Daniel Kraft, Alexander Komposch, Hannes Eder, Paul Ganitzer | 2012-12-04 |
| 8156643 | Semiconductor device | Manfred Schneegans, Markus Leicht, Edmund Riedl | 2012-04-17 |
| 8097918 | Semiconductor arrangement including a load transistor and sense transistor | Christoph Kadow, Markus Leicht | 2012-01-17 |
| 7834427 | Integrated circuit having a semiconductor arrangement | Thomas Detzel, Hubert Maier, Kai-Alexander Schreiber, Uwe Hoeckele | 2010-11-16 |