Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410950 | Semiconductor substrate having a bond pad material based on aluminum | Gert Pfahl, Marian Sebastian Broll, Michael Kreuz, Evelyn Napetschnig, Holger Schulze +1 more | 2022-08-09 |
| 9925588 | Semiconductor module bonding wire connection method | Achim Froemelt, Christian Kersting, Christian Stahlhut | 2018-03-27 |
| 8981553 | Power semiconductor module with integrated thick-film printed circuit board | Ulrich Michael Georg Schwarzer | 2015-03-17 |