Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756923 | High density and durable semiconductor device interconnect | Barbara Eichinger, Alexander Herbrandt, Alparslan Takkac | 2023-09-12 |
| 11410950 | Semiconductor substrate having a bond pad material based on aluminum | Gert Pfahl, Daniel Bolowski, Michael Kreuz, Evelyn Napetschnig, Holger Schulze +1 more | 2022-08-09 |