Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12041755 | Power semiconductor module arrangement and method for producing a power semiconductor module arrangement | Regina Nottelmann, Andre Arens, Michael Ebli, Ulrich Michael Georg Schwarzer, Alparslan Takkac | 2024-07-16 |
| 11856718 | Housing for a power semiconductor module arrangement | Philipp Bräutigam, Andre Arens, Marco Ludwig | 2023-12-26 |
| 11756923 | High density and durable semiconductor device interconnect | Marian Sebastian Broll, Barbara Eichinger, Alparslan Takkac | 2023-09-12 |
| 11533824 | Power semiconductor module and a method for producing a power semiconductor module | Regina Nottelmann, Andre Arens, Michael Ebli, Ulrich Michael Georg Schwarzer, Alparslan Takkac | 2022-12-20 |
| 11114780 | Electronic module with an electrically conductive press-fit terminal having a press-fit section | Katharina Teichmann | 2021-09-07 |
| 10693248 | Method for electrically connecting an electronic module and electronic assembly | Katharina Teichmann | 2020-06-23 |
| 9731370 | Directly cooled substrates for semiconductor modules and corresponding manufacturing methods | Andre Uhlemann | 2017-08-15 |
| 9585241 | Substrate, chip arrangement, and method for manufacturing the same | Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz | 2017-02-28 |
| 9275926 | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip | Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz +2 more | 2016-03-01 |
| 8872332 | Power module with directly attached thermally conductive structures | Andre Uhlemann, Frank Broermann | 2014-10-28 |