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Electronic module including a semiconductor package connected to a fluid heatsink |
Edward Fuergut, Davide Chiola, Martin Gruber |
2024-04-09 |
| 11862533 |
Fluid-cooled package having shielding layer |
Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass |
2024-01-02 |
| 11574889 |
Power module comprising two substrates and method of manufacturing the same |
Ottmar Geitner, Andreas Grassmann, Frank Winter, Christian Neugirg, Ivan Nikitin |
2023-02-07 |
| 11244886 |
Package cooled with cooling fluid and comprising shielding layer |
Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass |
2022-02-08 |
| 10615097 |
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet |
Andreas Grassmann, Juergen Hoegerl, Angela Kessler, Ivan Nikitin, Achim Strass |
2020-04-07 |
| 10461017 |
Package with partially encapsulated cooling channel for cooling an encapsulated chip |
Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass |
2019-10-29 |
| 10283432 |
Molded package with chip carrier comprising brazed electrically conductive layers |
Mark Pavier, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more |
2019-05-07 |
| 10128165 |
Package with vertically spaced partially encapsulated contact structures |
Andreas Grassmann, Juergen Hoegerl, Eduard Knauer, Michael Ledutke |
2018-11-13 |
| 10079195 |
Semiconductor chip package comprising laterally extending connectors |
Martin Gruber, Juergen Hoegerl |
2018-09-18 |
| 10074590 |
Molded package with chip carrier comprising brazed electrically conductive layers |
Mark Pavier, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more |
2018-09-11 |
| 10037972 |
Electronic module comprising fluid cooling channel and method of manufacturing the same |
Edward Fuergut, Martin Gruber |
2018-07-31 |
| 9589922 |
Electronic module and method of manufacturing the same |
Christian Neugirg, Andreas Grassmann, Ottmar Geitner, Frank Winter, Alexander Schwarz +1 more |
2017-03-07 |
| 9585241 |
Substrate, chip arrangement, and method for manufacturing the same |
Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt |
2017-02-28 |
| 9397018 |
Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit |
Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Manfred Mengel +2 more |
2016-07-19 |
| 9275926 |
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip |
Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt +2 more |
2016-03-01 |
| 7592696 |
Power module having at least two substrates |
— |
2009-09-22 |
| 7176057 |
Power module comprising at least two substrates and method for producing the same |
— |
2007-02-13 |
