Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955407 | Electronic module including a semiconductor package connected to a fluid heatsink | Edward Fuergut, Davide Chiola, Martin Gruber | 2024-04-09 |
| 11862533 | Fluid-cooled package having shielding layer | Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2024-01-02 |
| 11574889 | Power module comprising two substrates and method of manufacturing the same | Ottmar Geitner, Andreas Grassmann, Frank Winter, Christian Neugirg, Ivan Nikitin | 2023-02-07 |
| 11244886 | Package cooled with cooling fluid and comprising shielding layer | Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2022-02-08 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Juergen Hoegerl, Angela Kessler, Ivan Nikitin, Achim Strass | 2020-04-07 |
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2019-10-29 |
| 10283432 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2019-05-07 |
| 10128165 | Package with vertically spaced partially encapsulated contact structures | Andreas Grassmann, Juergen Hoegerl, Eduard Knauer, Michael Ledutke | 2018-11-13 |
| 10079195 | Semiconductor chip package comprising laterally extending connectors | Martin Gruber, Juergen Hoegerl | 2018-09-18 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2018-09-11 |
| 10037972 | Electronic module comprising fluid cooling channel and method of manufacturing the same | Edward Fuergut, Martin Gruber | 2018-07-31 |
| 9589922 | Electronic module and method of manufacturing the same | Christian Neugirg, Andreas Grassmann, Ottmar Geitner, Frank Winter, Alexander Schwarz +1 more | 2017-03-07 |
| 9585241 | Substrate, chip arrangement, and method for manufacturing the same | Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt | 2017-02-28 |
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Manfred Mengel +2 more | 2016-07-19 |
| 9275926 | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip | Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt +2 more | 2016-03-01 |
| 7592696 | Power module having at least two substrates | — | 2009-09-22 |
| 7176057 | Power module comprising at least two substrates and method for producing the same | — | 2007-02-13 |