Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431395 | Semiconductor power module with crack sensing | Arne Eilers | 2025-09-30 |
| 12390887 | Method for separating substrates | Sven Buchholz | 2025-08-19 |
| 12205826 | Method for forming a semiconductor substrate arrangement | Martin Goldammer, Lydia Lottspeich, Ulrich Wilke | 2025-01-21 |
| 11217467 | Transport system | Michael Daginnus-Metzen, Evelin Palko, Benedikt Reuber | 2022-01-04 |
| 10283432 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow +1 more | 2019-05-07 |
| 10141199 | Selecting a substrate to be soldered to a carrier | Jean-Laurent Deborde, Martin Haller, Nils Alexander Sanetra, Vasile Vartolomei | 2018-11-27 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow +1 more | 2018-09-11 |