Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068274 | Semiconductor die being connected with a clip and a wire which is partially disposed under the clip | — | 2024-08-20 |
| 12063474 | Methods of environmental protection for silicon MEMS structures in cavity packages | Paul Westmarland, Bernd Goller, Scott Palmer | 2024-08-13 |
| 12057376 | Three level interconnect clip | Azlina Kassim, Thai Kee Gan, Ke Yan Tean, Mohd Hasrul Zulkifli | 2024-08-06 |
| 11609180 | Emitter package for a photoacoustic sensor | Siyuan Qi, Joachim Eder, Christoph Glacer, Dominic Maier | 2023-03-21 |
| 11393743 | Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation | Stuart Cardwell, Chee Yang Ng, Josef Maerz, Clive O'Dell | 2022-07-19 |
| 10283432 | Molded package with chip carrier comprising brazed electrically conductive layers | Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2019-05-07 |
| 10103076 | Semiconductor package including a semiconductor die having redistributed pads | Andrew N. Sawle, Martin Standing | 2018-10-16 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2018-09-11 |
| 9673109 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2017-06-06 |
| 9633951 | Semiconductor package including a semiconductor die having redistributed pads | Andrew N. Sawle, Martin Standing | 2017-04-25 |
| 9576887 | Semiconductor package including conductive carrier coupled power switches | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2017-02-21 |
| 9502395 | Power semiconductor package having vertically stacked driver IC | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-11-22 |
| 9397212 | Power converter package including top-drain configured power FET | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-07-19 |
| 9362221 | Surface mountable power components | Daniel Cutler, Scott Palmer, Clive O'Dell, Rupert Burbidge | 2016-06-07 |
| 9299690 | Method for fabricating a power semiconductor package including vertically stacked driver IC | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-03-29 |
| 9269655 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-02-23 |
| 9159703 | Power converter package including vertically stacked driver IC | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2015-10-13 |
| 9111921 | Semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2015-08-18 |
| 9012990 | Surface mountable power components | Daniel Cutler, Scott Palmer, Clive O'Dell, Rupert Burbidge | 2015-04-21 |
| 8836145 | Power semiconductor device with reduced contact resistance | Sven Fuchs | 2014-09-16 |
| 8552543 | Semiconductor package | — | 2013-10-08 |
| 8466546 | Chip-scale package | Andy Farlow, Andrew N. Sawle, George Pearson, Martin Standing | 2013-06-18 |
| 8390131 | Semiconductor device with reduced contact resistance | Sven Fuchs | 2013-03-05 |
| 8143729 | Autoclave capable chip-scale package | Danish Khatri, Daniel Cutler, Andrew N. Sawle, Susan Johns, Martin Carroll +1 more | 2012-03-27 |
| 8089147 | IMS formed as can for semiconductor housing | David Bushnell | 2012-01-03 |