| 12499343 |
Wafer-level package sensor device |
Frank Puschner, Bernd Ebersberger |
2025-12-16 |
|
| 12068274 |
Semiconductor die being connected with a clip and a wire which is partially disposed under the clip |
— |
2024-08-20 |
|
| 12063474 |
Methods of environmental protection for silicon MEMS structures in cavity packages |
Paul Westmarland, Bernd Goller, Scott Palmer |
2024-08-13 |
|
| 12057376 |
Three level interconnect clip |
Azlina Kassim, Thai Kee Gan, Ke Yan Tean, Mohd Hasrul Zulkifli |
2024-08-06 |
|
| 11609180 |
Emitter package for a photoacoustic sensor |
Siyuan Qi, Joachim Eder, Christoph Glacer, Dominic Maier |
2023-03-21 |
|
| 11393743 |
Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation |
Stuart Cardwell, Chee Yang Ng, Josef Maerz, Clive O'Dell |
2022-07-19 |
|
| 10283432 |
Molded package with chip carrier comprising brazed electrically conductive layers |
Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more |
2019-05-07 |
|
| 10103076 |
Semiconductor package including a semiconductor die having redistributed pads |
Andrew N. Sawle, Martin Standing |
2018-10-16 |
|
| 10074590 |
Molded package with chip carrier comprising brazed electrically conductive layers |
Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more |
2018-09-11 |
|
| 9673109 |
Method for fabricating a semiconductor package with conductive carrier integrated heat spreader |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2017-06-06 |
|
| 9633951 |
Semiconductor package including a semiconductor die having redistributed pads |
Andrew N. Sawle, Martin Standing |
2017-04-25 |
|
| 9576887 |
Semiconductor package including conductive carrier coupled power switches |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2017-02-21 |
|
| 9502395 |
Power semiconductor package having vertically stacked driver IC |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2016-11-22 |
|
| 9397212 |
Power converter package including top-drain configured power FET |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2016-07-19 |
|
| 9362221 |
Surface mountable power components |
Daniel Cutler, Scott Palmer, Clive O'Dell, Rupert Burbidge |
2016-06-07 |
|
| 9299690 |
Method for fabricating a power semiconductor package including vertically stacked driver IC |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2016-03-29 |
|
| 9269655 |
Method for fabricating a semiconductor package with conductive carrier integrated heat spreader |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2016-02-23 |
|
| 9159703 |
Power converter package including vertically stacked driver IC |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2015-10-13 |
|
| 9111921 |
Semiconductor package with conductive carrier integrated heat spreader |
Eung San Cho, Andrew N. Sawle, Daniel Cutler |
2015-08-18 |
|
| 9012990 |
Surface mountable power components |
Daniel Cutler, Scott Palmer, Clive O'Dell, Rupert Burbidge |
2015-04-21 |
|
| 8836145 |
Power semiconductor device with reduced contact resistance |
Sven Fuchs |
2014-09-16 |
$17,481,000 |
| 8552543 |
Semiconductor package |
— |
2013-10-08 |
$4,599,000 |
| 8466546 |
Chip-scale package |
Andy Farlow, Andrew N. Sawle, George Pearson, Martin Standing |
2013-06-18 |
$10,207,000 |
| 8390131 |
Semiconductor device with reduced contact resistance |
Sven Fuchs |
2013-03-05 |
$5,156,000 |
| 8143729 |
Autoclave capable chip-scale package |
Danish Khatri, Daniel Cutler, Andrew N. Sawle, Susan Johns, Martin Carroll +1 more |
2012-03-27 |
$5,488,000 |
