Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354934 | Method of manufacturing a semiconductor device | Siang Miang Yeo | 2025-07-08 |
| 12057376 | Three level interconnect clip | Azlina Kassim, Thai Kee Gan, Mark Pavier, Ke Yan Tean | 2024-08-06 |
| 11769748 | Semiconductor device having a metal clip with a solder volume balancing reservoir | Thomas Stoek, Michael Stadler | 2023-09-26 |
| 11764135 | Method of manufacturing a semiconductor device | Siang Miang Yeo | 2023-09-19 |
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Ralf Otremba, Teck Sim Lee, Klaus Schiess, Xaver Schloegel, Lee Shuang Wang | 2023-06-13 |
| 11545459 | Metal clip with solder volume balancing reservoir | Thomas Stoek, Michael Stadler | 2023-01-03 |
| 11355424 | Multi-chip package | Ralf Otremba, Teck Sim Lee, Lee Shuang Wang | 2022-06-07 |
| 10896869 | Method of manufacturing a semiconductor device | Siang Miang Yeo | 2021-01-19 |
| 10833008 | Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure | Siang Miang Yeo | 2020-11-10 |
| 10121742 | Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure | Siang Miang Yeo | 2018-11-06 |