Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Chii Shang Hong, Ralf Otremba, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Hui Kin Lit, Ke Yan Tean +2 more | 2023-10-31 |
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Ralf Otremba, Klaus Schiess, Xaver Schloegel, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2023-06-13 |
| 11600547 | Semiconductor package with expanded heat spreader | Jo Ean Joanna Chye, Ke Yan Tean, Wei Wang | 2023-03-07 |
| 11355424 | Multi-chip package | Ralf Otremba, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2022-06-07 |
| 11348866 | Package and lead frame design for enhanced creepage and clearance | Thai Kee Gan, Edward Fuergut, Lee Shuang Wang | 2022-05-31 |
| 10727151 | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package | Liu Chen, Jia Yi Wong, Wei Han Koo, Thomas Stoeck, Gilles Delarozee | 2020-07-28 |
| 10699978 | SMD package with top side cooling | Ralf Otremba, Amirul Afiq Hud, Xaver Schloegel, Bernd Schmoelzer | 2020-06-30 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Guenther Lohmann +5 more | 2019-08-06 |
| 10290567 | Transistor package with three-terminal clip | Rainald Sander, Liu Chen | 2019-05-14 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess +3 more | 2019-02-12 |
| 10147703 | Semiconductor package for multiphase circuitry device | Stefan Macheiner, Amirul Afiq Hud, Thomas Stoek, Lee Shuang Wang, Chooi Mei Chong +1 more | 2018-12-04 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Norbert Joson Santos +2 more | 2018-09-25 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Ralf Otremba, Chooi Mei Chong, Raynold Talavera Corocotchia, Sanjay Kumar Murugan, Klaus Schiess +2 more | 2018-07-31 |
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Josef Hoeglauer, Ralf Otremba, Klaus Schiess, Xaver Schloegel, Juergen Schredl | 2018-06-05 |
| 9978671 | Power semiconductor device | Ralf Otremba, Fabio Brucchi, Xaver Schloegel, Franz Stueckler | 2018-05-22 |
| 9972576 | Semiconductor chip package comprising side wall marking | Ralf Otremba, Amirul Afiq Hud, Fabian Schnoy, Felix Grawert, Uwe Kirchner +2 more | 2018-05-15 |
| 9922910 | Functionalized interface structure | Ralf Otremba, Edward Fuergut, Christian Kasztelan, Hsieh Ting Kuek, Sanjay Kumar Murugan +1 more | 2018-03-20 |
| 9373566 | High power electronic component with multiple leadframes | Ralf Otremba, Klaus Schiess | 2016-06-21 |
| 9324642 | Method of electrically isolating shared leads of a lead frame strip | Frank Puschner, Bernhard Schätzler, Franz Gabler, Pei Pei Kong, Boon Huat Lim | 2016-04-26 |
| 9263563 | Semiconductor device package | Ralf Otremba, Fabio Brucchi, Franz Stückler | 2016-02-16 |
| 9230880 | Electronic device and method for fabricating an electronic device | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2016-01-05 |
| 9035437 | Packaged device comprising non-integer lead pitches and method of manufacturing the same | Ralf Otremba, Guenther Lohmann, Josef Hoeglauer, Matteo-Alessandro Kutschak, Wolfgang Peinhopf | 2015-05-19 |