Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929298 | Molded semiconductor package with dual integrated heat spreaders | Edward Fuergut, Ralf Otremba | 2024-03-12 |
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Chii Shang Hong, Teck Sim Lee, Hui Kin Lit, Ke Yan Tean +2 more | 2023-10-31 |
| 11600547 | Semiconductor package with expanded heat spreader | Teck Sim Lee, Ke Yan Tean, Wei Wang | 2023-03-07 |
| 11011456 | Lead frames including lead posts in different planes | Thai Kee Gan, Lee Shuang Wang | 2021-05-18 |