Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080625 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Chii Shang Hong, Azlina Kassim | 2024-09-03 |
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Ke Yan Tean +2 more | 2023-10-31 |
| 11791238 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Chii Shang Hong, Azlina Kassim | 2023-10-17 |