Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Lee Shuang Wang | 2024-09-17 |
| 12057376 | Three level interconnect clip | Azlina Kassim, Thai Kee Gan, Mark Pavier, Mohd Hasrul Zulkifli | 2024-08-06 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Lee Shuang Wang | 2024-01-16 |
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit +2 more | 2023-10-31 |
| 11652078 | High voltage semiconductor package with pin fit leads | Edmund Sales Cabatbat, Thai Kee Gan, Kean Ming Koe | 2023-05-16 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe +7 more | 2023-04-04 |
| 11600547 | Semiconductor package with expanded heat spreader | Jo Ean Joanna Chye, Teck Sim Lee, Wei Wang | 2023-03-07 |
| 11211353 | Clips for semiconductor packages | Mohd Kahar Bajuri, Abdul Rahman Mohamed, Siang Kuan Chua | 2021-12-28 |
| 11069600 | Semiconductor package with space efficient lead and die pad design | Thomas Bemmerl, Thai Kee Gan, Azlina Kassim | 2021-07-20 |