Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205874 | Semiconductor package with wire bond joints | Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew | 2025-01-21 |
| 11842953 | Semiconductor package with wire bond joints and related methods of manufacturing | Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew | 2023-12-12 |
| 11705387 | Multi-layer interconnection ribbon | Emil Lamco Jocson, Ryan Tordillo Comadre | 2023-07-18 |
| 11211353 | Clips for semiconductor packages | Abdul Rahman Mohamed, Siang Kuan Chua, Ke Yan Tean | 2021-12-28 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee, Norbert Joson Santos +2 more | 2018-09-25 |