Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347554 | Spatially selective roughening of encapsulant to promote adhesion with functional structure | Edward Fuergut, Sanjay Kumar Murugan | 2019-07-09 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee +2 more | 2018-09-25 |
| 8716845 | Lead frame strip for reduced mold sticking during degating | Edgar Dorotayo Balidoy, Anthony Steven Dominisac Panagan, Jerry Gomez Cayabyab, Ferdinand S. Signey | 2014-05-06 |
| 8297472 | Pellet loader with pellet separator for molding IC devices | Edgar Dorotayo Balidoy, Anthony Steven Dominisac Panagan, Freddie Mariano Dela Cruz | 2012-10-30 |