Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502045 | Electronic device with step cut lead | Wei Fen Sueann Lim, Adi Irwan Herman | 2022-11-15 |
| 10699978 | SMD package with top side cooling | Ralf Otremba, Teck Sim Lee, Xaver Schloegel, Bernd Schmoelzer | 2020-06-30 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Uwe Kirchner, Teck Sim Lee, Guenther Lohmann +5 more | 2019-08-06 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess, Lee Shuang Wang +3 more | 2019-02-12 |
| 10147703 | Semiconductor package for multiphase circuitry device | Stefan Macheiner, Teck Sim Lee, Thomas Stoek, Lee Shuang Wang, Chooi Mei Chong +1 more | 2018-12-04 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Teck Sim Lee, Norbert Joson Santos +2 more | 2018-09-25 |
| 9972576 | Semiconductor chip package comprising side wall marking | Ralf Otremba, Teck Sim Lee, Fabian Schnoy, Felix Grawert, Uwe Kirchner +2 more | 2018-05-15 |