Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021011 | Solder surface features for integrated circuit packages | Amirul Afiq Bin Hud, Adi Irwan Bin Herman | 2024-06-25 |
| 11791170 | Universal semiconductor package molds | Anis Fauzi Bin Abdul Aziz, Chong Han Lim, Lee Han Meng@Eugene Lee | 2023-10-17 |
| 11742263 | Flippable leadframe for packaged electronic system having vertically stacked chip and components | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2023-08-29 |
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Chong Han Lim, Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz, Siew Kee Lee | 2023-04-11 |
| 11569152 | Electronic device with lead pitch gap | Anis Fauzi Bin Abdul Aziz, Lee Han Meng@Eugene Lee, Siew Kee Lee | 2023-01-31 |
| 11502045 | Electronic device with step cut lead | Amirul Afiq Hud, Adi Irwan Herman | 2022-11-15 |
| 11373940 | Method of making leadframe strip | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2022-06-28 |
| 11348806 | Making a flat no-lead package with exposed electroplated side lead surfaces | Lee Han Meng@ Eugene Lee, Shu Hui Ooi, Anis Fauzi Abdul Aziz | 2022-05-31 |
| 11056462 | Locking dual leadframe for flip chip on leadframe packages | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2021-07-06 |
| 10879154 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2020-12-29 |
| 10784190 | Method of making leadframe strip | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2020-09-22 |
| 10541225 | Methods of assembling a flip chip on a locking dual leadframe | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2020-01-21 |
| 10115660 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2018-10-30 |
| 9892936 | Packaged semiconductor device having leadframe features preventing delamination | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2018-02-13 |
| 9842807 | Integrated circuit assembly | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2017-12-12 |