| 11742263 |
Flippable leadframe for packaged electronic system having vertically stacked chip and components |
Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim |
2023-08-29 |
| 11348806 |
Making a flat no-lead package with exposed electroplated side lead surfaces |
Shu Hui Ooi, Anis Fauzi Abdul Aziz, Wei Fen Sueann Lim |
2022-05-31 |
| 11056462 |
Locking dual leadframe for flip chip on leadframe packages |
Wei Fen Sueann Lim, Anis Fauzi Bin Abdul Aziz |
2021-07-06 |
| 10879154 |
Flippable leadframe for packaged electronic system having vertically stacked chips and components |
Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim |
2020-12-29 |
| 10804114 |
Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides |
You Chye How |
2020-10-13 |
| 10720406 |
Stacked semiconductor system having interposer of half-etched and molded sheet metal |
Anis Fauzi bin Abdul Aziz, Khoo Yien Sien |
2020-07-21 |
| 10541225 |
Methods of assembling a flip chip on a locking dual leadframe |
Wei Fen Sueann Lim, Anis Fauzi Bin Abdul Aziz |
2020-01-21 |
| 10515928 |
Stacked semiconductor system having interposer of half-etched and molded sheet metal |
Anis Fauzi bin Abdul Aziz, Khoo Yien Sien |
2019-12-24 |
| 9892936 |
Packaged semiconductor device having leadframe features preventing delamination |
Wei Fen Sueann Lim, Anis Fauzi Bin Abdul Aziz |
2018-02-13 |
| 9859197 |
Integrated circuit package fabrication |
Sueann Lim Wei Fen, Sarel Bin Ismail |
2018-01-02 |
| 9842807 |
Integrated circuit assembly |
Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim |
2017-12-12 |
| 9691748 |
Forming a panel of triple stack semiconductor packages |
Anis Fauzi Bin Abdul Aziz, Sueann Lim Wei Fen |
2017-06-27 |
| 9515009 |
Packaged semiconductor device having leadframe features preventing delamination |
Sueann Lim Wei Fen, Anis Fauzi Bin Abdul Aziz |
2016-12-06 |
| 9496206 |
Flippable leadframe for packaged electronic system having vertically stacked chips and components |
Anis Fauzi Bin Abdul Aziz, Sueann Lim Wei Fen |
2016-11-15 |
| 9324640 |
Triple stack semiconductor package |
Anis Fauzi Bin Abdul Aziz, Sueann Lim Wei Fen |
2016-04-26 |
| 9275983 |
Integrated circuit package |
Anis Fauzi Bin Abdul Aziz, Yien Sien Khoo |
2016-03-01 |
| 9184119 |
Lead frame with abutment surface |
Sueann Lim Wei Fen, Sarel Bin Ismail |
2015-11-10 |