Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087674 | Spring bar leadframe, method and packaged electronic device with zero draft angle | Lee Han Meng@Eugene Lee, Sueann Wei Fen Lim, Jin Keong Lim | 2024-09-10 |
| 11830791 | Leads for leadframe and semiconductor package | You Chye How | 2023-11-28 |
| 11791170 | Universal semiconductor package molds | Chong Han Lim, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2023-10-17 |
| 11742263 | Flippable leadframe for packaged electronic system having vertically stacked chip and components | Lee Han Meng@ Eugene Lee, Wei Fen Sueann Lim | 2023-08-29 |
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Chong Han Lim, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim, Siew Kee Lee | 2023-04-11 |
| 11569154 | Interdigitated outward and inward bent leads for packaged electronic device | Mohammad Waseem Hussain | 2023-01-31 |
| 11569152 | Electronic device with lead pitch gap | Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim, Siew Kee Lee | 2023-01-31 |
| 11373940 | Method of making leadframe strip | Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2022-06-28 |
| 11264310 | Spring bar leadframe, method and packaged electronic device with zero draft angle | Lee Han Meng@Eugene Lee, Sueann Wei Fen Lim, Jin Keong Lim | 2022-03-01 |
| 11056462 | Locking dual leadframe for flip chip on leadframe packages | Lee Han Meng@ Eugene Lee, Wei Fen Sueann Lim | 2021-07-06 |
| 10879154 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Lee Han Meng@ Eugene Lee, Wei Fen Sueann Lim | 2020-12-29 |
| 10784190 | Method of making leadframe strip | Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2020-09-22 |
| 10541225 | Methods of assembling a flip chip on a locking dual leadframe | Lee Han Meng@ Eugene Lee, Wei Fen Sueann Lim | 2020-01-21 |
| 10115660 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2018-10-30 |
| 9892936 | Packaged semiconductor device having leadframe features preventing delamination | Wei Fen Sueann Lim, Lee Han Meng@ Eugene Lee | 2018-02-13 |
| 9842807 | Integrated circuit assembly | Lee Han Meng@ Eugene Lee, Wei Fen Sueann Lim | 2017-12-12 |
| 9741643 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Lee Han Meng@Eugene Lee, Sueann Lim Wei Fen | 2017-08-22 |
| 9691748 | Forming a panel of triple stack semiconductor packages | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2017-06-27 |
| 9515009 | Packaged semiconductor device having leadframe features preventing delamination | Sueann Lim Wei Fen, Lee Han Meng@ Eugene Lee | 2016-12-06 |
| 9496206 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2016-11-15 |
| 9324640 | Triple stack semiconductor package | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2016-04-26 |
| 9275983 | Integrated circuit package | Lee Han Meng@ Eugene Lee, Yien Sien Khoo | 2016-03-01 |