Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859197 | Integrated circuit package fabrication | Lee Han Meng@ Eugene Lee, Sarel Bin Ismail | 2018-01-02 |
| 9741643 | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2017-08-22 |
| 9691748 | Forming a panel of triple stack semiconductor packages | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2017-06-27 |
| 9515009 | Packaged semiconductor device having leadframe features preventing delamination | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2016-12-06 |
| 9496206 | Flippable leadframe for packaged electronic system having vertically stacked chips and components | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2016-11-15 |
| 9324640 | Triple stack semiconductor package | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2016-04-26 |
| 9184119 | Lead frame with abutment surface | Lee Han Meng@ Eugene Lee, Sarel Bin Ismail | 2015-11-10 |
| 9013028 | Integrated circuit package and method of making | Lee Han Meng@Eugene Lee, Sarel Bin Ismail | 2015-04-21 |