Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859197 | Integrated circuit package fabrication | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2018-01-02 |
| 9184119 | Lead frame with abutment surface | Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen | 2015-11-10 |
| 9013028 | Integrated circuit package and method of making | Lee Han Meng@Eugene Lee, Sueann Lim Wei Fen | 2015-04-21 |