Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Chong Han Lim, Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim | 2023-04-11 |
| 11569152 | Electronic device with lead pitch gap | Anis Fauzi Bin Abdul Aziz, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2023-01-31 |
| 10943856 | System in package device including inductor | Yien Sien Khoo | 2021-03-09 |
| 10340210 | System in package device including inductor | Yien Sien Khoo | 2019-07-02 |
| 9123626 | Integrated passive flip chip package | You Chye How, Huay Yann Tay | 2015-09-01 |