Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328984 | Multi-die integrated circuit packages and methods of manufacturing the same | You Chye How, Franklin Santos Marcelino | 2022-05-10 |
| 9123626 | Integrated passive flip chip package | You Chye How, Siew Kee Lee | 2015-09-01 |