Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348806 | Making a flat no-lead package with exposed electroplated side lead surfaces | Lee Han Meng@ Eugene Lee, Shu Hui Ooi, Wei Fen Sueann Lim | 2022-05-31 |
| 9029990 | Integrated circuit package | Lee Hang Meng@Eugene Lee, Yien Sien Khoo | 2015-05-12 |