Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125772 | Method of forming a semiconductor package with connection lug | Edward Fuergut, Martin Gruber, Herbert Hopfgartner | 2024-10-22 |
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Edward Fuergut, Martin Gruber, Petteri Palm, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12002739 | Semiconductor device including an embedded semiconductor die | Edward Fuergut, Achim Althaus, Martin Gruber, Marco Mueller, Wolfgang Scholz +1 more | 2024-06-04 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Ralf Otremba, Daniel Pedone | 2024-03-26 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |
| 11728250 | Semiconductor package with connection lug | Edward Fuergut, Martin Gruber, Herbert Hopfgartner | 2023-08-15 |
| 11211304 | Assembly and method for mounting an electronic component to a substrate | Ralf Otremba, Guenther Lohmann, Fabian Schnoy | 2021-12-28 |
| 10755999 | Multi-package top-side-cooling | Ralf Otremba, Uwe Kirchner, Matteo-Alessandro Kutschak, Klaus Schiess | 2020-08-25 |
| 10699978 | SMD package with top side cooling | Ralf Otremba, Amirul Afiq Hud, Teck Sim Lee, Xaver Schloegel | 2020-06-30 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Teck Sim Lee +5 more | 2019-08-06 |
| 9972576 | Semiconductor chip package comprising side wall marking | Ralf Otremba, Teck Sim Lee, Amirul Afiq Hud, Fabian Schnoy, Felix Grawert +2 more | 2018-05-15 |