Issued Patents All Time
Showing 1–25 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412815 | Semiconductor package and method of manufacturing a semiconductor package | Thomas Beer, Daniel Hoelzl, Ralf Otremba | 2025-09-09 |
| 11923276 | Semiconductor device including a bidirectional switch | Ralf Otremba, Michael Treu | 2024-03-05 |
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Ralf Otremba, Teck Sim Lee, Xaver Schloegel, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2023-06-13 |
| 11605577 | Semiconductor device including a bidirectional switch | Ralf Otremba, Michael Treu | 2023-03-14 |
| 11289436 | Semiconductor package having a laser-activatable mold compound | Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Swee Kah Lee, Chee Yang Ng | 2022-03-29 |
| 11217510 | Semiconductor device including a bidirectional switch | Ralf Otremba, Michael Treu | 2022-01-04 |
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Chan Lam Cha, Wei Han Koo, Thorsten Meyer, Guan Choon Matthew Nelson Tee | 2021-08-03 |
| 10903133 | Method of producing an SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2021-01-26 |
| 10763246 | Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material | Ralf Otremba, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2020-09-01 |
| 10755999 | Multi-package top-side-cooling | Ralf Otremba, Uwe Kirchner, Matteo-Alessandro Kutschak, Bernd Schmoelzer | 2020-08-25 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Chooi Mei Chong, Markus Dinkel, Josef Hoeglauer, Xaver Schloegel | 2020-06-30 |
| 10698021 | Device including a compound semiconductor chip | Ralf Otremba | 2020-06-30 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2020-02-18 |
| 10418319 | Method of manufacturing a semiconductor device | Oliver Haeberlen, Stefan Kramp | 2019-09-17 |
| 10290566 | Electronic component | Ralf Otremba, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2019-05-14 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Lee Shuang Wang +3 more | 2019-02-12 |
| 10109609 | Connection structure and electronic component | Ralf Otremba, Josef Höglauer, Jürgen Schredl, Xaver Schlögel | 2018-10-23 |
| 10074597 | Interdigit device on leadframe for evenly distributed current flow | Eung San Cho, Oliver Haeberlen, Gilberto Curatola, Gerhard Prechtl | 2018-09-11 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Ralf Otremba, Chooi Mei Chong, Raynold Talavera Corocotchia, Teck Sim Lee, Sanjay Kumar Murugan +2 more | 2018-07-31 |
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Josef Hoeglauer, Teck Sim Lee, Ralf Otremba, Xaver Schloegel, Juergen Schredl | 2018-06-05 |
| 9961798 | Package and a method of manufacturing the same | Ralf Otremba, Khalil Hosseini | 2018-05-01 |
| 9952273 | Compound semiconductor device including a sensing lead | Ralf Otremba | 2018-04-24 |
| 9899481 | Electronic component and switch circuit | Ralf Otremba | 2018-02-20 |
| 9881862 | Top side cooling for GaN power device | Ralf Otremba | 2018-01-30 |
| 9824958 | Chip carrier structure, chip package and method of manufacturing the same | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2017-11-21 |