Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817407 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Woon Yik Yong | 2023-11-14 |
| 11355460 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Woon Yik Yong | 2022-06-07 |
| 10109609 | Connection structure and electronic component | Ralf Otremba, Josef Höglauer, Xaver Schlögel, Klaus Schiess | 2018-10-23 |
| 9196577 | Semiconductor packaging arrangement | Ralf Otremba, Josef Höglauer, Xaver Schlögel, Klaus Schiess | 2015-11-24 |
| 9196554 | Electronic component, arrangement and method | Ralf Otremba, Josef Höglauer, Xaver Schlögel, Klaus Schiess | 2015-11-24 |
| 9099391 | Semiconductor package with top-side insulation layer | Ralf Otremba, Wolfgang Peinhopf, Fabio Brucchi, Josef Höglauer | 2015-08-04 |
| 6328200 | Process for selective soldering | Paul Kasulke | 2001-12-11 |