Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9099391 | Semiconductor package with top-side insulation layer | Ralf Otremba, Jürgen Schredl, Fabio Brucchi, Josef Höglauer | 2015-08-04 |
| 9035437 | Packaged device comprising non-integer lead pitches and method of manufacturing the same | Ralf Otremba, Guenther Lohmann, Josef Hoeglauer, Teck Sim Lee, Matteo-Alessandro Kutschak | 2015-05-19 |
| 8618644 | Electronic device and manufacturing thereof | Ralf Otremba, Marco Seibt, Uwe Kirchner, Michael Treu, Andreas Schloegl +1 more | 2013-12-31 |
| 8253225 | Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof | Ralf Otremba, Marco Seibt, Uwe Kirchner, Michael Treu, Andreas Schloegl +1 more | 2012-08-28 |