Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211304 | Assembly and method for mounting an electronic component to a substrate | Ralf Otremba, Bernd Schmoelzer, Fabian Schnoy | 2021-12-28 |
| 10903133 | Method of producing an SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2021-01-26 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2020-02-18 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Teck Sim Lee +5 more | 2019-08-06 |
| 9035437 | Packaged device comprising non-integer lead pitches and method of manufacturing the same | Ralf Otremba, Josef Hoeglauer, Teck Sim Lee, Matteo-Alessandro Kutschak, Wolfgang Peinhopf | 2015-05-19 |