Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Josef Hoeglauer, Ralf Otremba | 2023-10-03 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Josef Hoeglauer, Ralf Otremba | 2022-04-12 |
| 11211304 | Assembly and method for mounting an electronic component to a substrate | Ralf Otremba, Guenther Lohmann, Bernd Schmoelzer | 2021-12-28 |
| 10651109 | Selective plating of semiconductor package leads | Syahir Abd Hamid, Jagen Krishnan, Mian Mian Lam, Jayaganasan Narayanasamy, Thomas Stoek +1 more | 2020-05-12 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Teck Sim Lee +5 more | 2019-08-06 |
| 10085353 | Solder bridging prevention structures for circuit boards and semiconductor packages | Carlo Marbella | 2018-09-25 |
| 9972576 | Semiconductor chip package comprising side wall marking | Ralf Otremba, Teck Sim Lee, Amirul Afiq Hud, Felix Grawert, Uwe Kirchner +2 more | 2018-05-15 |